Corporate dynamics
Missing weld ★ Printing: offset, solder paste thickness is not uniform, the amount of tin is less ★ Patch: offset, mounting pressure, thimble positioning is poor ★ Reflow welding: the temperature setting is not appropriate, the elemen
After welding PCB surface residual dirty board? 1. No preheating or preheating temperature is too low before welding (dip welding, time is too short). 2. The board speed is too fast (the FLUX is not fully volatilized). 3. The temperat
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