This series of products is widely used in LED products, suitable for efficient printing processes
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This series of products is dedicated to radiator welding, according to different production processes of customers, there are two kinds of packaging: needle packaging and ordinary canned, suitable for efficient printing process and tin point process, belo
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A single-component, modified epoxy resin adhesive for BGA, CSP, and Flip chip bottom fill processes, which forms a consistent and defectless bottom fill layer and effectively reduces the impact caused by the overall temperature expansion characteristic mi
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