Because IC parts and various electronic components pin in the component manufacturing process, after a variety of processes, some work sequence is carried out at high temperature, so the oxide layer of the pin is thicker, more pollution. To help the flux deoxygenation layer and decontamination force is very strong, and the wetting force of the flux is better, the flux should be evenly spread to the pin, in order to make the tin uniform, this series of products is for the above requirements and made of tin special flux, and the external PCB board needs to be cleaned by ultrasonic cleaning, this series of products is also the best choice.